Teledyne Imaging Sensors offers a wide range of standard and custom imaging subsystems. Customized design and fabrication services are available in infrared, visible, multispectral, hyperspectral, and LADAR formats. Additionally, we offer sensor fusion, which combines multiple image sources to form composite images.

Of particular interest is the focal plane array (FPA) application specific integrated circuit (ASIC), which supplies all clocks and biases, and performs analog-to-digital (ADC) conversion of readout integrated circuit (ROIC) data. The result is a system that is more efficient and compact.

Teledyne Imaging Sensors supports system-enabling / enhancing technologies through services and products:

• Custom subsystems in infrared, visible, multispectral, hyperspectral, LADAR, and sensor fusion
• Microlenses and micromachining
• Thin film multispectral filters and linear variable filters
• FPA Packaging with integrated dewar cooling assemblies (IDCAs), and Application Specific Integrated Circuit (ASIC) focal plane array support electronics
• Thermoelectric cooling and liquid nitrogen cooling
• In-house optics capabilities for special shielding and thin film filters
• FPA support electronics from very high-speed board/chassis rack assemblies to extremely compact chip-on-board assemblies for clock and bias generation, data acquisition, and post-processing

For more information contact us at:
imaging@teledyne-si.com